A new anti-counterfeiting requirement from the U.S. Defense Logistics Agency (DLA) at Fort Belvoir, Va., is triggering pushback from semiconductor manufacturers, who claim the new requirement is not an appropriate cure for electronics counterfeiting, does not adequate authenticate legacy semiconductors, has not been tested adequately, and will increase semiconductor manufacturing costs.The DNA-marking mandate, which became effective on 15 November […]
Applied, chip, counterfeit, Defense Logistics Agency, DLA, DNA, DOD, IC, marking, miltaryToshiba has revealed a security module for automotive microcontrollers meeting industry anti-hacking, anti-tamper and software theft standards. Developed at the company’s automotive development centre in Düsseldorf, the Toshiba Security Module will be built into future generations of the company’s ARM Cortex-based automotive microcontrollers. “The module’s firmware is, as a first release step, compliant with the Secure […]
ARM, automotive, chip, IC, Security, ToshibaLONDON – Microsemi Corp. has denied that there is a “backdoor” in its ProASIC3 FPGAs that would allow users or hackers to circumvent security features. However, the company has also disclosed that a next-generation of programmable devices with enhanced protection will be announced soon.Microsemi (Aliso Viejo, Calif.) has published a statement following assertionsmade by academics in Cambridge, England, […]
backdoor, FPGA, IC, Microsemi, trojanTAIPEI – Etron Technoogy Inc. has started work on buffered DRAM designs geared for 3-D ICs using through-hole vias. The company is also working on an upgrade of a low-cost gesture recognition module. Chip stacking technology has the potential to disrupt business models and traditional systems design, said Nicky Lu, the company’s founder and chief […]
3D, IC, memory, stack, TSVDevelop an affordable x-ray microscope system for use in performing integrated circuit (IC) reverse engineering via SBIR/STTR Interactive Topic Information System (SITIS). Editor’s note: An important first step in developing a comprehensive X-ray inspection program to detect counterfeit and trojan ICs.
chip, counterfeit, DMEA, IC, inspection, reverse engineering, semiconductor, trojan, x-rayExecutives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node. via Chip execs see 20 nm variants, 3-D ICs ahead.
2014, 20nm, 3D, 7nm, IC, Moore's Law, semiconductorAmid the industry’s insatiable thirst for more bandwidth, Cisco Systems Inc. said that it wants 2.5D/3D stacked devices sooner than later and is getting “impatient” regarding the overall progress of the technology. Only a smattering of 2.5D/3D chips have been announced and shipped in the market today. Despite the hype for the technology in recent […]
2.5D, 2014, 3D, Cisco, IC, semicondcutor, volumeSetting the stage for intense competition in an emerging market, GlobalFoundries Inc. on Thursday (April 26) officially entered the 2.5D/3D chip-stacking foundry arena. The company’s 2.5D/3D foundry strategy is far different than that of rival Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) GlobalFoundries Enters 2.5D/3D Chip Foundry Market.
2.5D, 3D, Global Foundries, IC, semiconductorThe IC industry must embrace — and become more active — in the standards process to help jumpstart the 2.5D/3D chip era, according to a panel at the recent Mentor Graphics User Group Meeting in Santa Clara, Calif. One of the members of the panel also challenged conventional wisdom, saying that 2.5D devices based on interposers could be more […]
2.5D, 3D, device, IC, panel, standards…3D-ICs are “almost getting mainstream” and are moving along the adoption curve….many types of 2.5D and 3D-ICs that are already in design or production by memory, foundry, CPU/GPU, FPGA, and mobile providers. Qualcomm is investigating stacked dies including memory and logic. Why? As 2D scaling gets more expensive, 3D “seems like a very good opportunity.” […]
3D, 3D IC, Altera, cadence, EDA, IC, Qualcomm, Rahman, Tools, TSMC(c) 2012 Chip Security - Web Design by Blue Mustang
