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Etron designing DRAMs for through silicon vias

Posted on June 3, 2012 by John in News

TAIPEI – Etron Technoogy Inc. has started work on buffered DRAM designs geared for 3-D ICs using through-hole vias. The company is also working on an upgrade of a low-cost gesture recognition module. Chip stacking technology has the potential to disrupt business models and traditional systems design, said Nicky Lu, the company’s founder and chief [...]

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3D, IC, memory, stack, TSV

Microsoft to Join 3D TSV DRAM Consortium | Semiconductor Manufacturing & Design Community

Posted on May 27, 2012 by John in News

The Hybrid Memory Cube Consortium (HMCC) — the 3D DRAM effort led by Micron Technology Inc. and Samsung Electronics Co. Ltd. — said that software giant Microsoft Corp. has joined the group. Last October, memory rivals Samsung and Micron announced the creation of a consortium to develop an open interface specification for a 3D memory technology called [...]

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3D, Consortium, DRAM, memory, Microsoft, Micrton, TSV

Chip execs see 20 nm variants, 3-D ICs ahead

Posted on April 27, 2012 by John in News

Executives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node. via Chip execs see 20 nm variants, 3-D ICs ahead.

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2014, 20nm, 3D, 7nm, IC, Moore's Law, semiconductor

Cisco Wants 2.5D/3D Chips Sooner than Later

Posted on April 27, 2012 by John in News

Amid the industry’s insatiable thirst for more bandwidth, Cisco Systems Inc. said that it wants 2.5D/3D stacked devices sooner than later and is getting “impatient” regarding the overall progress of the technology. Only a smattering of 2.5D/3D chips have been announced and shipped in the market today. Despite the hype for the technology in recent [...]

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2.5D, 2014, 3D, Cisco, IC, semicondcutor, volume

GlobalFoundries Enters 2.5D/3D Chip Foundry Market

Posted on April 27, 2012 by John in News

Setting the stage for intense competition in an emerging market, GlobalFoundries Inc. on Thursday (April 26) officially entered the 2.5D/3D chip-stacking foundry arena. The company’s 2.5D/3D foundry strategy is far different than that of rival Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) GlobalFoundries Enters 2.5D/3D Chip Foundry Market.

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2.5D, 3D, Global Foundries, IC, semiconductor

Transparent, Flexible, Scalable 3D Memory

Posted on April 19, 2012 by John in News

According to the article, these chips could replace flash memory in thumb drives, smart phones and computers. The transparency also makes it perfect for touchscreen displays, and such futuristic concepts as smart glass for windshields that could then have functionality built into something that previously just served the purpose of optics. via Transparent, Flexible, Scalable [...]

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3D, flexible, memory, transparent

Panel: Let’s Rally Around 3D Chip Standards

Posted on April 17, 2012 by John in News

The IC industry must embrace — and become more active — in the standards process to help jumpstart the 2.5D/3D chip era, according to a panel at the recent Mentor Graphics User Group Meeting in Santa Clara, Calif. One of the members of the panel also challenged conventional wisdom, saying that 2.5D devices based on interposers could be more [...]

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2.5D, 3D, device, IC, panel, standards

3D-IC “Almost Getting Mainstream”

Posted on April 17, 2012 by John in News

…3D-ICs are “almost getting mainstream” and are moving along the adoption curve….many types of 2.5D and 3D-ICs that are already in design or production by memory, foundry, CPU/GPU, FPGA, and mobile providers. Qualcomm is investigating stacked dies including memory and logic. Why? As 2D scaling gets more expensive, 3D “seems like a very good opportunity.” [...]

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3D, 3D IC, Altera, cadence, EDA, IC, Qualcomm, Rahman, Tools, TSMC

ADVANCED PACKAGING: 3D IC, WLP & TSV : Stacked DRAM in a multicore system

Posted on April 4, 2012 by John in News

The “Euro cloud” program is a 3D server on chip concept to integrate ARM processor cores with 3D DRAM for very dense, low power data centers for mobile cloud services for hand held devices. The goal of this european commission funded project is to support hundreds cores in a single server and show the path [...]

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3D, ARM, die, IC, on chip, server, stacked

Interposer supply/ecosystem examined at IMAPS Device Packaging – ElectroIQ

Posted on March 20, 2012 by John in News

Interposer supply/ecosystem examined at IMAPS Device Packaging – ElectroIQ. 2.5 D interposers are an important part of the 3D IC evolution path. While TSMC prefers to keep interposers and assembly in-house, other foundries are looking to outsourced assembly and test groups, allowing mixing and matching of die, to handle their packaging. Why is this important? [...]

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2.5 D, 3D, chip, die, interposers
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