Executives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node. via Chip execs see 20 nm variants, 3-D ICs ahead.
Amid the industry’s insatiable thirst for more bandwidth, Cisco Systems Inc. said that it wants 2.5D/3D stacked devices sooner than later and is getting “impatient” regarding the overall progress of the technology. Only a smattering of 2.5D/3D chips have been announced and shipped in the market today. Despite the hype for the technology in recent […]2.5D, 2014, 3D, Cisco, IC, semicondcutor, volume