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ADVANCED PACKAGING: 3D IC, WLP & TSV : Stacked DRAM in a multicore system

Posted on April 4, 2012 by John in News

The “Euro cloud” program is a 3D server on chip concept to integrate ARM processor cores with 3D DRAM for very dense, low power data centers for mobile cloud services for hand held devices. The goal of this european commission funded project is to support hundreds cores in a single server and show the path […]

3D, ARM, die, IC, on chip, server, stacked

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