Chip Security
  • Email
  • Home
  • News
  • Reports
  • Opinion
  • Tools
  • About

Huawei, Altera mix FPGA, memory in 2.5-D device

Posted on November 14, 2012 by John in News

Huawei and Altera will package an FPGA and a Wide I/O memory on a 2.5-D silicon interposer to bust through memory bandwidth limits in communications systems. The technology presents thorny challenges but could become critical in networking, said a senior scientist for Huawei. The new device, in the works only about three months, will significantly […]

2.5 D, 2.5D, Altera, Huawei, Interposer, networking, trojan

Recent Posts

  • Design for Security: Needed More than Ever
  • New DARPA Program Seeks to Reveal Backdoors and Other Hidden Malicious Functionality in Commercial IT Devices
  • Electrical testing to track fake military parts
  • DOD requirement to mark parts with unique DNA
  • Toshiba adds IP protection to automotive MCUs

Recent Comments

    (c) 2012 Chip Security - Web Design by Blue Mustang