Huawei and Altera will package an FPGA and a Wide I/O memory on a 2.5-D silicon interposer to bust through memory bandwidth limits in communications systems. The technology presents thorny challenges but could become critical in networking, said a senior scientist for Huawei. The new device, in the works only about three months, will significantly [...]
2.5 D, 2.5D, Altera, Huawei, Interposer, networking, trojanAfter pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center (GT-PRC) is beginning Phase 2 in June. The industry consortium involves about ~30 semiconductor, package, and related supply-chain companies from the US, Europe, and Asia. They developed glass and silicon interposers with 10x [...]
2.5 D, Interposer, semiconductor(c) 2012 Chip Security - Web Design by Blue Mustang
