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Cadence/TSMC 3D Test: Closer Than Ever

Posted on June 12, 2012 by John in News

At DAC, Cadence announced a full suite of tools that they have been working on with TSMC to create what they are calling the CoWoS Design Ecosystem. I met with John Murphy and Samta Bansal to find out more. The first obvious question is CoWoS, what is that? It stands for chip-on-wafer-on-substrate (or sometimes on-silicon) […]

3D IC, Heterogeneous, integrated circuit, Taiwan, TSMC

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