Setting the stage for intense competition in an emerging market, GlobalFoundries Inc. on Thursday (April 26) officially entered the 2.5D/3D chip-stacking foundry arena. The company’s 2.5D/3D foundry strategy is far different than that of rival Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) GlobalFoundries Enters 2.5D/3D Chip Foundry Market.
2.5D, 3D, Global Foundries, IC, semiconductorGlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows [...]
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