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GlobalFoundries Enters 2.5D/3D Chip Foundry Market

Posted on April 27, 2012 by John in News

Setting the stage for intense competition in an emerging market, GlobalFoundries Inc. on Thursday (April 26) officially entered the 2.5D/3D chip-stacking foundry arena. The company’s 2.5D/3D foundry strategy is far different than that of rival Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) GlobalFoundries Enters 2.5D/3D Chip Foundry Market.

2.5D, 3D, Global Foundries, IC, semiconductor

GlobalFoundries installs gear for 20nm TSVs (3D IC)

Posted on April 26, 2012 by John in News

GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows […]

20nm, 3D IC, die, Global Foundries, stacked, Through Silicon Via, TSV

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