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3D-IC “Almost Getting Mainstream”

Posted on April 17, 2012 by John in News

…3D-ICs are “almost getting mainstream” and are moving along the adoption curve….many types of 2.5D and 3D-ICs that are already in design or production by memory, foundry, CPU/GPU, FPGA, and mobile providers. Qualcomm is investigating stacked dies including memory and logic. Why? As 2D scaling gets more expensive, 3D “seems like a very good opportunity.” [...]

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3D, 3D IC, Altera, cadence, EDA, IC, Qualcomm, Rahman, Tools, TSMC

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