GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows [...]
20nm, 3D IC, die, Global Foundries, stacked, Through Silicon Via, TSVThe “Euro cloud” program is a 3D server on chip concept to integrate ARM processor cores with 3D DRAM for very dense, low power data centers for mobile cloud services for hand held devices. The goal of this european commission funded project is to support hundreds cores in a single server and show the path [...]
3D, ARM, die, IC, on chip, server, stackedInterposer supply/ecosystem examined at IMAPS Device Packaging – ElectroIQ. 2.5 D interposers are an important part of the 3D IC evolution path. While TSMC prefers to keep interposers and assembly in-house, other foundries are looking to outsourced assembly and test groups, allowing mixing and matching of die, to handle their packaging. Why is this important? [...]
2.5 D, 3D, chip, die, interposers
Trojan Integrated Circuits Sounding the Bell on 3D IC Security John Ellis Counterfeit: made in imitation of something else with intent to deceive (Webster) Trojan Horse: someone or something intended to defeat or subvert from within usually by deceptive means (Webster) _________________________________________ e can spot a fake when we see one. Misprinted labels, stitched logos [...]
3D, chip, circuit, counterfeit, die, IC, integrated, malicious, semiconductor, stacked, trojan(c) 2012 Chip Security - Web Design by Blue Mustang
