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GlobalFoundries installs gear for 20nm TSVs (3D IC)

Posted on April 26, 2012 by John in News

GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows […]

20nm, 3D IC, die, Global Foundries, stacked, Through Silicon Via, TSV

ADVANCED PACKAGING: 3D IC, WLP & TSV : Stacked DRAM in a multicore system

Posted on April 4, 2012 by John in News

The “Euro cloud” program is a 3D server on chip concept to integrate ARM processor cores with 3D DRAM for very dense, low power data centers for mobile cloud services for hand held devices. The goal of this european commission funded project is to support hundreds cores in a single server and show the path […]

3D, ARM, die, IC, on chip, server, stacked

Interposer supply/ecosystem examined at IMAPS Device Packaging – ElectroIQ

Posted on March 20, 2012 by John in News

Interposer supply/ecosystem examined at IMAPS Device Packaging – ElectroIQ. 2.5 D interposers are an important part of the 3D IC evolution path. While TSMC prefers to keep interposers and assembly in-house, other foundries are looking to outsourced assembly and test groups, allowing mixing and matching of die, to handle their packaging. Why is this important? […]

2.5 D, 3D, chip, die, interposers

Trojan Integrated Circuits

Posted on February 27, 2012 by John Ellis in Reports
Trojan Integrated Circuits

Trojan Integrated Circuits Sounding the Bell on 3D IC Security John Ellis Counterfeit: made in imitation of something else with intent to deceive (Webster) Trojan Horse: someone or something intended to defeat or subvert from within usually by deceptive means (Webster) _________________________________________  e can spot a fake when we see one. Misprinted labels, stitched logos […]

3D, chip, circuit, counterfeit, die, IC, integrated, malicious, semiconductor, stacked, trojan

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