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Cisco Wants 2.5D/3D Chips Sooner than Later

Posted on April 27, 2012 by John in News

Amid the industry’s insatiable thirst for more bandwidth, Cisco Systems Inc. said that it wants 2.5D/3D stacked devices sooner than later and is getting “impatient” regarding the overall progress of the technology. Only a smattering of 2.5D/3D chips have been announced and shipped in the market today. Despite the hype for the technology in recent […]

2.5D, 2014, 3D, Cisco, IC, semicondcutor, volume

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