…3D-ICs are “almost getting mainstream” and are moving along the adoption curve….many types of 2.5D and 3D-ICs that are already in design or production by memory, foundry, CPU/GPU, FPGA, and mobile providers. Qualcomm is investigating stacked dies including memory and logic. Why? As 2D scaling gets more expensive, 3D “seems like a very good opportunity.” […]
