Huawei and Altera will package an FPGA and a Wide I/O memory on a 2.5-D silicon interposer to bust through memory bandwidth limits in communications systems. The technology presents thorny challenges but could become critical in networking, said a senior scientist for Huawei. The new device, in the works only about three months, will significantly [...]
2.5 D, 2.5D, Altera, Huawei, Interposer, networking, trojan…3D-ICs are “almost getting mainstream” and are moving along the adoption curve….many types of 2.5D and 3D-ICs that are already in design or production by memory, foundry, CPU/GPU, FPGA, and mobile providers. Qualcomm is investigating stacked dies including memory and logic. Why? As 2D scaling gets more expensive, 3D “seems like a very good opportunity.” [...]
3D, 3D IC, Altera, cadence, EDA, IC, Qualcomm, Rahman, Tools, TSMC(c) 2012 Chip Security - Web Design by Blue Mustang
