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Huawei, Altera mix FPGA, memory in 2.5-D device

Posted on November 14, 2012 by John in News

Huawei and Altera will package an FPGA and a Wide I/O memory on a 2.5-D silicon interposer to bust through memory bandwidth limits in communications systems. The technology presents thorny challenges but could become critical in networking, said a senior scientist for Huawei. The new device, in the works only about three months, will significantly […]

2.5 D, 2.5D, Altera, Huawei, Interposer, networking, trojan

3D-IC “Almost Getting Mainstream”

Posted on April 17, 2012 by John in News

…3D-ICs are “almost getting mainstream” and are moving along the adoption curve….many types of 2.5D and 3D-ICs that are already in design or production by memory, foundry, CPU/GPU, FPGA, and mobile providers. Qualcomm is investigating stacked dies including memory and logic. Why? As 2D scaling gets more expensive, 3D “seems like a very good opportunity.” […]

3D, 3D IC, Altera, cadence, EDA, IC, Qualcomm, Rahman, Tools, TSMC

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