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Chip execs see 20 nm variants, 3-D ICs ahead

Posted on April 27, 2012 by John in News

Executives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node. via Chip execs see 20 nm variants, 3-D ICs ahead.

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2014, 20nm, 3D, 7nm, IC, Moore's Law, semiconductor

GlobalFoundries installs gear for 20nm TSVs (3D IC)

Posted on April 26, 2012 by John in News

GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows [...]

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20nm, 3D IC, die, Global Foundries, stacked, Through Silicon Via, TSV

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