Executives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node. via Chip execs see 20 nm variants, 3-D ICs ahead.
GlobalFoundries installs gear for 20nm TSVs (3D IC)
GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows […]
20nm, 3D IC, die, Global Foundries, stacked, Through Silicon Via, TSV