Huawei and Altera will package an FPGA and a Wide I/O memory on a 2.5-D silicon interposer to bust through memory bandwidth limits in communications systems. The technology presents thorny challenges but could become critical in networking, said a senior scientist for Huawei. The new device, in the works only about three months, will significantly […]
2.5 D, 2.5D, Altera, Huawei, Interposer, networking, trojanAfter pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center (GT-PRC) is beginning Phase 2 in June. The industry consortium involves about ~30 semiconductor, package, and related supply-chain companies from the US, Europe, and Asia. They developed glass and silicon interposers with 10x […]
2.5 D, Interposer, semiconductorInterposer supply/ecosystem examined at IMAPS Device Packaging – ElectroIQ. 2.5 D interposers are an important part of the 3D IC evolution path. While TSMC prefers to keep interposers and assembly in-house, other foundries are looking to outsourced assembly and test groups, allowing mixing and matching of die, to handle their packaging. Why is this important? […]
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