LONDON – Microsemi Corp. has denied that there is a “backdoor” in its ProASIC3 FPGAs that would allow users or hackers to circumvent security features. However, the company has also disclosed that a next-generation of programmable devices with enhanced protection will be announced soon.Microsemi (Aliso Viejo, Calif.) has published a statement following assertionsmade by academics in Cambridge, England, [...]
backdoor, FPGA, IC, Microsemi, trojanWeihai, Shangdong, May 29th, 2012 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, today celebrated the official opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building is part of ASE’s expansion plans to increase its manufacturing capacity for discrete [...]
ASE, assembly, China, packaging, testTAIPEI – Etron Technoogy Inc. has started work on buffered DRAM designs geared for 3-D ICs using through-hole vias. The company is also working on an upgrade of a low-cost gesture recognition module. Chip stacking technology has the potential to disrupt business models and traditional systems design, said Nicky Lu, the company’s founder and chief [...]
3D, IC, memory, stack, TSVTwo Cambridge experts have discovered a “back door” in a computer chip used in military systems and aircraft such as the Boeing 787 that could allow the chip to be taken over via the internet. The discovery will heighten concerns about the risks of cyber-attacks on sensitive installations, coming on the heels of the discovery this week of [...]
alcatel, backdoor, cambridge, chip, cyber, trojanDuring last days an insistent news circulated on internet, a microchip used by the US military and manufactured in China contains a secret “backdoor” that make possible a remote control of the devices. China-made US military chip, security backdoor or debugging functionality? | Security Affairs. Where malicious or placed in as part of debug feature, [...]
backdoor, cambridge, chip, integrated circuit, military, semiconductor, trojanThe Hybrid Memory Cube Consortium (HMCC) — the 3D DRAM effort led by Micron Technology Inc. and Samsung Electronics Co. Ltd. — said that software giant Microsoft Corp. has joined the group. Last October, memory rivals Samsung and Micron announced the creation of a consortium to develop an open interface specification for a 3D memory technology called [...]
3D, Consortium, DRAM, memory, Microsoft, Micrton, TSVDevelop an affordable x-ray microscope system for use in performing integrated circuit (IC) reverse engineering via SBIR/STTR Interactive Topic Information System (SITIS). Editor’s note: An important first step in developing a comprehensive X-ray inspection program to detect counterfeit and trojan ICs.
chip, counterfeit, DMEA, IC, inspection, reverse engineering, semiconductor, trojan, x-rayBBC News – China fake parts ‘used in US military equipment’.
armed services, counterfeit parts, military systems, reportTri-Gate power consumption is higher than expected A 22nm SoC optimized process will be expensive The 22nm to 14nm migration is not scaling as expected via SemiWiki – Intel TriGate is in Trouble?!?!?!. Editor’s Note: I’m sure Intel will get all of this sorted out, but it doesn’t bode well for continued scaling being cost [...]
14nm, 22nm, expensive, FinFET, Intel, problems, scaling, SoC, TrigateBy 2016 most cars will have smart phone integration, according to a new report from Juniper Research, a wireless technology research firm based in Hampshire, U.K. Aftermarket systems offered by companies like OnStar will help grow the sector to $14.4 billion in four years and give 92 million vehicles Internet connectivity. In Four Years, Most [...]
3D IC, attack, Car, smart phone, social network, trojan(c) 2012 Chip Security - Web Design by Blue Mustang
