The IC industry must embrace — and become more active — in the standards process to help jumpstart the 2.5D/3D chip era, according to a panel at the recent Mentor Graphics User Group Meeting in Santa Clara, Calif.
One of the members of the panel also challenged conventional wisdom, saying that 2.5D devices based on interposers could be more difficult to develop than true stacked 3D chips. If anything, 2.5D chips might be more difficult to devise and commercialize, according to one panelist.
The bottom line is cost. Before the technology is viable, “3D must hit a certain price point,” said Riko Radojcic, director of engineering for Qualcomm Inc., during the panel at the event. “We will start seeing products at the high-end,” Radojcic said, but the devices “will trickle down” to more mainstream applications once the costs drop.