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GlobalFoundries installs gear for 20nm TSVs (3D IC)

Posted on April 26, 2012 by John in News - No Comments

GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.

GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows to create stacks with through-silicon vias (TSVs). The foundry’s archrival, Taiwan Semiconductor Manufacturing Co.,announced late last yearit will go it alone, handling all steps in the 3-D stacking process in a move TSMC said will reduce costs and risks of shipping the thin wafers the technique requires.

GlobalFoundries installs gear for 20nm TSVs.

20nm, 3D IC, die, Global Foundries, stacked, Through Silicon Via, TSV

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