GlobalFoundries is installing equipment to make through-silicon vias in its Fab 8 in New York. If all goes well, the company hopes to take production orders in the second half of 2013 for 3-D chip stacks using 20 and 28 nm process technology.
GlobalFoundries is working with multiple packaging companies including Amkor to develop process flows to create stacks with through-silicon vias (TSVs). The foundry’s archrival, Taiwan Semiconductor Manufacturing Co.,announced late last yearit will go it alone, handling all steps in the 3-D stacking process in a move TSMC said will reduce costs and risks of shipping the thin wafers the technique requires.
