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GlobalFoundries Enters 2.5D/3D Chip Foundry Market

Posted on April 27, 2012 by John in News - No Comments

Setting the stage for intense competition in an emerging market, GlobalFoundries Inc. on Thursday (April 26) officially entered the 2.5D/3D chip-stacking foundry arena. The company’s 2.5D/3D foundry strategy is far different than that of rival Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)

GlobalFoundries Enters 2.5D/3D Chip Foundry Market.

2.5D, 3D, Global Foundries, IC, semiconductor

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