TSMC CDNLive! Keynote – “We Can Beat Moore’s Law” – Industry Insights – Cadence Community.
In a great write-up by Richard Goering, Rick Cassidy from TSMC states…
“We don’t see an end to Moore’s Law,” Cassidy said. “We are working at 14nm, 10nm and beyond with lots of innovations. I think we can actually beat Moore’s Law.” He spoke of the 12″ wafer “gigafabs” that TSMC is building, and that are already cranking out more than 100,000 wafers per month. He also said that TSMC has invested $13 billion between this year and last year, and 80% of that has gone into building 28nm and 20nm capacity. “We have the capacity in place to serve your needs,” he said.
There is an opportunity to “outpace” Moore’s Law, he said, through 3D-ICs as well as “2.5D ICs” using silicon interposers. “It really perpetuates the scaling opportunity, and if you think about it, there’s a great deal the system designer can do while architecting new products, with different ways to solve problems.”