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TSMC, Altera team on 3-D IC test vehicle

Posted on March 22, 2012 by John in News - No Comments

Claiming an industry first, foundry Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and programmable logic vendor Altera Corp. Thursday (March 22) announced the joint development of a heterogeneous 3-D IC test vehicle using TSMC’s chip-on-wafer-on-substrate integration process.

via TSMC, Altera team on 3-D IC test vehicle.

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